For this project, which was intended for a fiber optic application, we drilled a series of five by five blind micro-hole arrays in a sapphire wafer using an ArF excimer laser with a wavelength of 193 nm.
The wafer had a diameter of 100 mm. Each hole had a diameter of 200 μm at the entrance of the hole, with a bottom diameter of 150 μm. The bottoms of the holes were flat to within 5 μm. The side walls of each hole had a surface roughness of approximately 1 μm.
At the request of the client, Precision MicroFab manufactured 20 different hole geometries for testing purposes.
If you’d like more information on this project or if you’re interested in a similar service, please contact us.