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These probes needed to be tapered down to a 6 μm truncated pyramid.

Probe tip shaping

Electronics
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Our infrared fiber lasers can create irregular features in a silicon wafer with knife-edge quality

Silicon wafer cutting

Electronics
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Diode mount

Micro-milling

Electronics
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The bottoms of these blind micro-holes have a diameter of 150 μm and are flat to within 5 μm.

Blind micro-holes in sapphire

Electronics
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Like all proper welds, this laser weld is stronger than the surrounding material.

Laser welding metal

Electronics
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Laser welding plastic

Laser welding plastic

Electronics
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The wires in this micro-array were wound and adjusted using an apparatus invented by Precision MicroFab.

Micro-device design and build

Aerospace, Electronics
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The hole pitch was 120 μm with 5 μm interstitial spacing.

Micro-drilling glass

Electronics
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laser mIcro-soldering 50 µm wide leads on a ceramic substrate

Micro-soldering

Electronics
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